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IRF1010NSTRL Datasheet
IRF1010NSTRL Cross Reference
IRF1010NSTRL Schematic
IRF1010NSTRL Distributor
IRF1010NSTRL Datenblatt
IRF1010NSTRL RoHS
IRF1010NSTRL Equivalent
IRF1010NSTRL Application Notes
IRF1010NSTRL Data Sheet
IRF1010NSTRL component
IRF1010NSTRL Fiche Technique
IRF1010NSTRL Circuit
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Description
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRF1010NL) is available for lowprofile applications.
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IRF1010NSTRL.pdf